Rymoslite – Photonic and RF Design and Consulting

Slide 1

Custom Photonic PIC Design

-Passive and active photonic components
- Full PIC design, layout, validation and tapeout
- Photonic PDK development

- Passive and active photonic components
- Full PIC design, layout, validation and tapeout
- Photonic PDK development

Custom Photonic PIC Design

Slide 2

Photonic Package Design

- Photonic package feasibility study and prototyping
- Fiber to chip coupling simulation and analysis
- RF package substrate, interposer, design

Slide 3

Photonic and RF Consulting

- Advise on PIC system development
- Performing feasibility studies
- Identify PIC fabrication and packaging partners

Rymoslite specializes in custom PIC chip development, offering expertise in passive and active photonic component design, full PIC design and tape-out, PDK development and multi-product wafer (MPW) submission to photonic foundries.

Our services also include photonic package development, including RF substrate or interposer design and fiber-to-chip coupling. We can do feasibility studies for your photonic project starting from concept development to prototyping by working with our partners. Below are our key expertise.

- Custom Integrated Photonic Chip (PIC) Development
- Photonic Package Design: Optical and RF design
- Photonic Consulting

Photonic integrated circuit design, simulation and analysis

Co-package optics: Shows one edge of electronic ASIC interfacing with 4-photonic modules.

Have Questions? Contact Us!

e-mail: info@rymoslite.com