Rymoslite specializes in custom PIC chip development, offering expertise in passive and active photonic component design, full PIC design and tape-out, PDK development and multi-product wafer (MPW) submission to photonic foundries.
Our services also include photonic package development, including RF substrate or interposer design and fiber-to-chip coupling. We can do feasibility studies for your photonic project starting from concept development to prototyping by identifying photonic foundry and packaging partners.
Our Services
End-to-end photonic solutions tailored to your specifications
Photonic System Design Meets AI
In order to meet the demands of AI, the Photonic industry is pushing toward targets >10× improvements in energy efficiency and up to ~90% cost reduction compared to current pluggable systems. This is precisely where agentic execution platforms could unlock structural leverage by integrating currently disjointed photonic design tools into a unified, automated workflow—where natural-language prompts initiate design, optimization, and verification of photonic building blocks through full-chip tapeout—can dramatically compress iteration cycles. Taking it a step further, virtual fab AI agents that co-optimize PDKs, process corners, and yield sensitivities prior to physical fabrication would allow teams to effectively “pre-tapeout” GDSII designs into a simulated manufacturing stack—surfacing variability risks, process incompatibilities, and packaging constraints before committing to the multi-month fab loop.
Photonic Design Tools Expertise
Deep knowledge across the photonic integration stack
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Photonic
RF Design
Design Automation
3D Cad Tools