Integrated photonics is currently experiencing rapid development, by the increasing demand for higher speed, lower power consumption, and smaller form factor systems driven by the exponential growth of Artificial Intelligence (AI).

The growing demand for customized PICs is creating a need for companies that can provide design and fabrication services tailored to specific applications.

Our company specializes in custom PIC chip development, offering expertise in passive and active photonic component design, full PIC design and tape-out, PDK development and multi-product wafer (MPW) submission to photonic foundries.

Our services also include photonic package development, including RF substrate or interposer design and fiber-to-chip coupling. We can do feasibility studies for your photonic project starting from concept development to prototyping by working with our partners.

At Rymoslite, we have decades of industry experience at the top semiconductor companies as technical leaders with a proven track record of photonic R&D, pioneering groundbreaking work in chip-to-chip optical interconnects. Our extensive experience allows us to offer our customers a comprehensive suite of services, ranging from concept, design to full photonic prototyping services.