Custom PIC Chip Development
- Passive and active photonic component design
- Full PIC design, layout, validation and tape-out
- PDK Development: SOI, SiN, TFLN, EOP
- Multi-project wafer submission
Photonic Package Development
- RF substrate, Si interposer design
- Fiber-to-chip coupling
Photonic Consulting
- Photonic package feasibility study
- Optical interconnect prototyping
- Recommend Photonic and RF testing equipment
- Advise on high-speed photonic measurements
Design Tools
- Photonic: Ansys Lumerical, MODE, FTDT, Interconnect, Tidy3d FTDT, other script based (Python) open source design tools
- RF: Ansys HFSS, Circuit, COMSOL multi-physics, open source and custom developed tools
- Opto-mechanical: Zemax Optical Studio
